Dynatem Inroduces a Rugged, Low-Power Pentium M CPU in a Single 3U CompactPCI Slot

Features:

Mission Viejo, California, October 2006 - Dynatem is now shipping the Intel Pentium M-based C3PM. The C3PM supports an x86 processor that is ideal for embedded, rugged applications with its low power consumption. The high-speed 855GME & 6300ESB chipset supports a 66 MHZ PCI-X expansion bus that can fully utilize the two Gb Ethernet ports available on the C3PM with no data transfer bottleneck. An attached sub-module supports CompactFlash for single-slot booting. I/O routed to the backplane includes a Serial ATA port, two Gb Ethernet ports, SVGA, two USB 2.0 ports, and two COM ports.

The C3RM was designed in compliance with VITA 30.1-2002 so it comes with top and bottom cooling plates that are bonded to the major components through thermal conduction and to the heat conducting printed circuit board mechanically. Wedge locks secure the C3RM in the chassis and bring the module's heat from the cooling plates and the PCB and, ultimately, the components to a heat plate in the chassis. The C3PM has no socketed components, other than the optional CompactFlash drive (PXE is supported for diskless booting), so it remains rugged in high shock and vibration environments.

The C3PM's Pentium M processor utilizes a new micro architecture to meet the current and future demands of high-performance, low-power embedded computing, making it ideal for communications and industrial automation applications. It features advanced branch prediction capability, micro-ops fusion for improved instruction execution, and a dedicated hardware stack manager that employs sophisticated hardware control for improved stack management.

The C3PM's 855GME and 6300ESB chipset includes DRAM controller, PCI bus arbitration logic and interface, high-performance PCI, USB 2.0 interfaces, RTC, NV-RAM, standard PC timers, Ultra DMA, and interrupt logic. The chipset also provides Ultra ATA 100/66/33 IDE protocol (for the CompactFlash drive sub-module that mounts to the top cooling plate) and Serial ATA. The C3PM comes populated with 512 MB of DDR-266 SDRAM with ECC and a memory bandwidth of 2.1 GB/s.

The 855GME offers integrated, high-performance graphics that can support resolutions up to 1600 x 1200 at 85 MHz. The C3PM routes an SVGA graphics interface to the J2 backplane connector.

The 6300ESB supports PCI-X transfer rates of 66 MHz (64-bit) for the high-bandwidth 82546 dual-port Gb Ethernet controller. The 6300ESB's other PCI port, a 32-bit @ 33 MHz interface, supports a PLX6254 PCI-CompactPCI bridge chip for the backplane interface. This is a 'universal' PCI-PCI bridge that can be used in the system slot on the backplane (in the transparent mode) or any of the peripheral slots (in the non-transparent mode).

The C3PM routes two USB 2.0 ports and two COM ports to the J2 backplane connector. One SerialATA port, two Gbit Ethernet ports, and the VGA interface are also routed to J2. A rear transition module is available that provides industry standard connectors for VGA, 2 x USB, 2 x LAN, SATA, and two COM port.

Dynatem offers board support packages for such popular operating systems as VxWorks, Windows NT, Windows XP, Linux, QNX, and Solaris. Support for other operating systems can be quoted upon request. PXE is available for diskless booting and fully volatile operation - desirable in secure systems.

Pricing for the C3PM starts at $3,100 in single quantity. Customized versions can be quoted upon request. The, a convection-cooled C3PM, is already shipping. C3RM conduction-cooled version will ship November 1, 2006.